New Trends: Currently, chip heat continues to rise, placing higher demands on heat dissipation; the power density per cabinet is constantly increasing, posing challenges to traditional heat dissipation methods; liquid-cooling has become an important new trend to address these changes and will be widely applied in related fields. New Products: The newly launched CDU product has significant advantages, efficiently adapting to high-power scenarios with excellent heat dissipation performance and energy efficiency. Its application scenarios cover data centers and other areas with concentrated high-power equipment. The C7000 2.0 is optimized and upgraded based on the new CDU, better meeting market demands. New Technologies: Megawatt-level immersion technology can efficiently handle large-scale heat dissipation; two-phase cold plate technology enhances the targeting and efficiency of heat dissipation; the medium-voltage direct conversion power supply system ensures stable power supply and contributes to the efficient operation of the overall system.